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YES announced a leadership transition as the company enters its next phase of growth with top-tier semiconductor and AI computing customers. Rezwan Lateef assumes the role of CEO, succeeding Rama Alapati, who will continue in a consulting capacity to ensure continuity. Under new leadership, YES will accelerate development of next-generation advanced packaging systems and strengthen partnerships across the rapidly expanding AI and HPC markets.

YES announced it has received multiple orders for its Dry and Wet process systems from a global AI infrastructure leader. The tools will support panel-level manufacturing on glass substrates for next-generation AI and HPC packaging, including curing, cleaning, reflow, and deposition solutions that enable high-throughput, glass-based 2.5D and 3D integration.

YES announced it has received multiple orders of its VeroTherm™ and VeroFlex™ reflow systems from a leading global memory supplier. The tools will support 3D stacking of memory and logic chips for high-performance AI accelerators, enabling sub-10 µm fluxless solder reflow with superior thermal uniformity and reliability.

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